Solutions

• FlexPack Series - SDC Power Module

  • Baseplate Pin Fin structure for assembly friendly and several power type options

  • Pin Fin & AMB & DBC with customized development for enhancing current sharing & thermal resistance capability

  • The lower stray inductance and higher steady current sharing & dynamic current sharing

  • Layout customized based on customer input & power density & stray inductance & current sharing requirements

  • The package covers both Si & SiC portfolios

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• CoolPack Series – SSC Power Module

  • Compared to HPD, SSC power module PC capability increase by more than 6 times

  • SSC power Module with high integration and compact design

  • SSC Structure design is compatible with either screwing or welding options. Heat dissipating surface combining with system press-fit or bolting or sintering requirements

  • The package covers both Si & SiC portfolios

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• IcyPack Series - DSC Power Module

  • Double side cooling, heat resistance decrease by 40%, boosting current outputting capability

  • Integrated current and temperature sensor, enhancing system protection and intelligent control capability

  • The structure meeting automotive PC/TC/TST reliability requirements

  • Long-term reliability guaranteed by optimized thickness and flatness control

  • The package covers both Si & SiC portfolios

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